BGA reballing
Over time, solder balls on electronic devices such as Ball Grid Array (BGA) chips can wear out due to heat, physical stress or manufacturing flaws. When this occurs, it can lead to issues with electrical connections, sporadic failures, and in the worse case even complete component breakdown. That is where reballing of these components comes in -- a technique to precisely restore these solder ball problems.
Laser reballing ensures that all the solder balls are uniform and well-controlled. This method is crucial for high-end industries for a couple of reasons:
Mitigates terminal stress: Laser reballing generates less heat, which reduces the risk of damaging delicate electronic components.
Precision and control: This reballing method excels in precision, enabling precise handling and placement of the balls.
Selective ball placement: The reballing process can focus on specific areas. This is convenient for repairing individual solder joints or tin balls.
Fine pitch components: The exceptional precision of the reballing machine handles closely spaced solder balls on components effortlessly.
Minimal flux residue: Laser reballing typically does not require any additional flux use on components, reducing the need for an extra cleaning cycle in the reballing process.
Reduced risk of deformation: Unlike reflow ovens, laser reballing avoids subjecting entire components to heat.
Real-time monitoring: Laser reballing equipment includes real-time monitoring and control to ensure optimal results.
