Automatic deballing of BGA components

Solder ball removing or deballing of BGA (Ball Grid Array) components is a crucial element in the realm of electronics. The first reason being the refurbishment of the so called “legacy components”. These components often have oxidized tin balls that have become worn over time. By replacing the worn tin balls with new ones, ART-Tronix enhances the solderability of these legacy components. This process improves their performance and extends their usability.

Another reason to remove the balls from components is to facilitate a process known as alloy conversion. The goal of this is achieving a convergence in the composition of tin alloys. This conversion can take the form of transitioning from a lead-free (e.g. SAC-305) to a lead-containing (e.g. Sn/Pb) composition or vice versa. This, of course,  depends on the specific requirements of the application.

The available robot-arm can also be used for degolding components. The gold finishing coat plays a vital role in preserving the components, extending their lifespan by preventing deterioration. To minimize oxide buildup, it is crucial to promptly mount the components after applying a tin coating to their connections.

Moreover, given the worldwide scarcity of specific components, the necessity of deballing and reballing practices becomes increasingly crucial. The capacity to refurbish and revitalize these components allows for their reuse, lessening dependence on scarce resources and promoting sustainable practices within the electronics industry. In essence, the deballing and reballing of BGA components provide diverse advantages, including alloy conversion, refurbishment of older components, restoration of disconnected tin balls, and supporting resource conservation amidst global scarcity. ART-TRONIX's expertise in these processes significantly contributes to the efficiency, reliability, and durability of electronic components across diverse applications.